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A Method of Controlling Sn-whiskers Formation for Aerospace Electronic Interconnect Applications
tm3008911060
Category of Technology / Product
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This invention promotes the influence of nickel additions to the SN-CU lead free solder alloy to control tin whiskers growth and enhancing its wettability and solder joint strength.

Industrial Design
No
Trademarks
No
Patent
No
Other IP Protection
No
Organization Name
Organization Category
Address

School Of Materials Engineering
Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP),
Taman Muhibbah, 02600 Jejawi, Arau, Perlis

02600 Arau
Perlis
Malaysia

Full Name [1]
Mohd Arif Anuar Bin Mohd Salleh
Email [1]
arifanuar@unimap.edu.my